Packaging - Molded

Molded Packaging for Demanding Criteria


JSP works closely with packaging molders who produce finished parts made from ARPAK® and / or ARPRO®, with design and technical support from JSP.

With an international presence in all major industrial regions, this can mean packaging consistency for global suppliers of products like consumer electronics. JSP products available for molded packaging include:

  • ARPAK® Expanded Polyethylene (EPE)
  • ARPRO® Expanded Polypropylene (EPP)
  • ARPRO® Porous Expanded Polypropylene (P-EPP)
  • ARPEX® Cross-linked Expanded Polyethylene (xEPE)

Anti-Static and Conductive Grades

ARPAK® EPE and ARPRO® EPP are available in Anti-Static and Conductive grades, each designed to meet specific "anti-stat" (ESD) packaging requirements. These specifications are particularly critical for sensitive electronic equipment and other applications where static sparks are hazardous.

Snap-Fit Function

The resilience and shape "memory" of ARPRO® makes it perfect for creating packaging where two parts snap-fit to fully enclose the product, and then can be easily opened, forming a re-usable and portable case, for some applications.

Flame Resistance

Certain packaging specifications may require flame resistant performance properties. All JSP packaging foams are available in FR grades, which meet North American standards for flame resistance, including FMVSS-302.

Chemical Resistance

All JSP packaging foams pass the US Coast Guard CGD-770145 requirement for fuel immersion (Fuel B), as well as a range of other standards for chemical resistance.

Let Us Help

Many other engineered packaging solutions are possible, as JSP engineers are expert at providing innovative solutions based on the unique material property combinations of these remarkable plastic foams. Contact us to discuss your needs.